Polymer waveguides show promise for reliable, high-capacity optical communication
Co-packaged optics (CPO) technology can integrate photonic integrated circuits (PICs) with electronic integrated circuits (EICs) like CPUs and GPUs on a single platform. This advanced technology has immense potential to improve data transmission efficiency within data centers and high-performance computing environments. CPO systems require a laser source for operation, which can be either integrated directly into the silicon photonic chips (integrated laser sources) or provided externally.
Co-packaged optics (CPO) technology can integrate photonic integrated circuits (PICs) with electronic integrated circuits (EICs) like CPUs and GPUs on a single platform. This advanced technology has immense potential to improve data transmission efficiency within data centers and high-performance computing environments. CPO systems require a laser source for operation, which can be either integrated directly into the silicon photonic chips (integrated laser sources) or provided externally.
